Multi-chip packages mount two (or more) chips in a single package to minimize the space required in critical applications, while increasing the memory density and offering the necessary different memory types. ST is a leader in MCP design and manufacturing technology, and has designed the new series to offer the widest range of NAND Flash and LPSDRAM combinations in one package, providing fast time-to-market and high design flexibility, and satisfying customers’ differing handset memory requirements.

The new MCPs can be configured in many different ways to match a variety of specific applications: bus width, memory density, clock frequency and data rate can be configured to meet specific requirements. The NAND Flash and LPSDRAM components have separate power supplies and ground lines, as well as separate control, address and I/O signals, to allow simultaneous access to both chips.

ST’s MCP options allow mobile phone makers to reduce the space requirement of their products – following the miniaturization trend of the market – and benefit from fast processing speed with low power consumption. The devices offer high memory density for storage of multimedia objects and have high data throughput. Other handheld applications include PDAs (Personal Digital Assistants) and GPS (Global Positioning System) units. All combinations are available now and offered in a range of BGA packages fully compatible with other devices available on the market.

Memory combinations available, initially, in the new MCP portfolio are:

Prices for the NAND Flash MCP devices range from $11 to $17 in large volumes from 1000k onwards.

More information on ST’s NAND Flash products is available at www.st.com/nand

 About ST’s Memory Product Group (MPG)
STMicroelectronics offers the industry’s widest range of semiconductor storage solutions for leading applications. The Company is a major supplier of non-volatile memories, including NOR and NAND Flash, EPROM/EEPROM, and Serial Flash. ST’s memory product portfolio also features a wide array of RFID ICs, as well as the most complete range of secure microcontrollers and System-on-Chip solutions for all major smart card application segments.