SM2T
TRANSILTM
FEATURES High Peak pulse power: 200 W (10/1000 s ) 1000 W ( 8/20 s) Stand-off voltage range 5 to 24V Unidirectional types Low clamping factor VCL/VBR
A K
Fast response time 1.0mm overall component height STmite (JEDEC DO-216AA)
DESCRIPTION The SM2T series are Transil diodes designed specifically for portable equipment and miniaturized electronics devices subject to ESD transient overvoltages. Fully compatible with pick and place equipment and inspectable soldering joints.
Table 1: Order Codes Part Number SM2T6V8A SM2T14A SM2T18A SM2T27A Marking MUA MUE MUG MUJ
Table 2: Absolute Ratings (Tamb = 25C) Symbol PPP P IFSM Tstg Tj TL Parameter Peak pulse power dissipation (see note ) Power dissipation on infinite heatsink Non repetitive surge peak forward current Storage temperature range Maximum junction temperature Maximum lead temperature for soldering during 10 s.
1
Value Tj initial = Tamb Tamb = 100C tp = 10 ms Tj initial = Tamb 200 2.5 25 -65 to 175 150 260
Unit W W A C C
Note 1: 10/1000s pulse waveform.
Table 3: Thermal Resistances Symbol Parameter Rth(j-t) Junction to tab Rth(j-a) Junction to ambient on PCB with recommended pad layout Value 20 250 Unit C/W C/W
January 2005
REV. 3
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SM2T
Table 4: Electrical Characteristics (Tamb = 25C) Symbol V RM VBR V CL IR M IPP T VF Parameter
IF I
Stand-off voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient Forward voltage drop
I PP VC L VB R VRM VF I RM V
IRM Types max A SM2T6V8A SM2T14A SM2T18A SM2T27A
Note 1: 10/1000s pulse waveform.
@
V RM
VBR min
@
IR
VCL @ max note1
IPP
T
max
C typ @ 0V pF 1600 650 500 350
V 5 12 16 24
V 6.4 13.3 17.1 25.7
mA 10 1 1 1
V 9.2 19.9 26 28.9
A 19.6 9 7 4.6
50 1 1 1
10-4/C 5.7 8.3 8.8 9.6
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Figure 1: Peak pulse power versus exponential pulse duration
PPP(W)
1.E+04
Tj initial = 25C
Figure 2: Relative variation of peak pulse power versus initial junction temperature
%
110 100 90 80
1.E+03
70 60 50
1.E+02
40 30 20
tp(ms)
1.E+01 0.01 0.10 1.00 10.00
10 0 0 25 50 75
Tj(C)
100 125 150 175
Figure 3: Average power dissipation versus ambient temperature
P(W)
3.0
TAMB = Ttab
Figure 4: Variation of thermal impedance junction to ambient versus pulse duration
Zth(j-c)/Rth(j-c)
1000.0
S=0.135cm²
2.5
100.0
2.0
S=2cm²
1.5
10.0
1.0
Printed circuit board FR4, recommended pad layout
1.0
0.5
TAMB(C)
0.0 0 25 50 75 100 125 150
0.1 1.E-03 1.E-02 1.E-01
tp(s)
1.E+00 1.E+01 1.E+02 1.E+03
Figure 5: Thermal resistance junction to ambient versus copper surface under tab
Rth(j-a)(C/W)
250
Figure 6: Reverse leakage current versus junction temperature (typical values)
IR(nA)
1.E+02
VR = VRM
200
1.E+01
150
1.E+00
100
1.E-01
50
S(cm²)
0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
Tj(C)
1.E-02 0 25 50 75 100 125 150
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SM2T
Figure 7: Clamping voltage versus peak pulse current (maximum values)
IPP(A)
100.0
Tj initial = 25C
Figure 8: Junction capacitance versus reverse voltage applied (typical values)
C(pF)
10000
8/20s
F=1MHz VOSC=30mVRMS Tj=25C
10/1000s
10.0
1000
SM2T6V8A
SM2T6V8A
SM2T14A SM2T18A SM2T14A
1.0
100
SM2T27A
SM2T18A SM2T27A
VCL(V)
0.1 0 5 10 15 20 25 30 35 40 45
VR(V)
10 1 10 100
Fig. 9: Forward voltage drop versus forward current (typical values)
IFM(A)
1.E+02
1.E+01
Tj = 150C
1.E+00
Tj = 25C
1.E-01
VFM(V)
1.E-02 0.0 0.5 1.0 1.5 2.0 2.5 3.0
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SM2T
Figure 10: STmite Package Mechanical Data DIME NS IONS Millimeters Inches Min. Typ. Max. Min. Typ. 0.85 1.00 1.15 0.033 0.039 0.10 0.40 0.65 0.016 0.70 1.00 0.027 0.10 0.25 0.004 1.75 1.90 2.05 0.069 0.007 1.75 1.90 2.05 0.069 0.007 3.60 3.75 3.90 0.142 0.148 0.50 0.63 0.80 0.020 0.025 1.20 1.35 1.50 0.047 0.053 0.50 0.019 ref ref 0.07 0.003 0.07 0.003
REF. A A1 b b2 c D E H L L2 L3 R R1
L3 D
b2
b
H L2 L R E
C A1 R1 0 to 6
A
Max. 0.045 0.004 0.025 0.039 0.010 0.081 0.081 0.154 0.031 0.059
Figure 11: STmite Foot Print Dimensions (in millimeters)
2.67 0.762 2.54 1.27
0.635
Table 5: Ordering Information Part Number SM2T6V8A SM2T14A SM2T18A SM2T27A Table 6: Revision History Date April-2002 Aug-2004 14-Jan-2005 Revision 1A 2 3 Last update. STmite package dimensions update. Minor layout update. No content change. Description of Changes Marking MUA MUE MUG MUJ STmite 15.5 mg 12000 Tape & reel Package Weight Base qty Delivery mode
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SM2T
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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