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| Features and Description |
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The STM32 interconnection board is designed to demonstrate several STMicroelectronics products:
- Motion sensors (MEMS) - ST’s low-g linear accelerometers are grouped in subfamilies according to the number of axes (2-axis and 3-axis), the package type (SO24, QFN or LGA) and the IC output (analog or digital). The MEMS sensor of a linear accelerometer is based on an inter-digitated, comb-like silicon structure composed of fixed and movable fingers. To sense the acceleration in different directions, these structures are packaged in orthogonal groups. The acceleration in each direction is sensed by measuring the displacements of the movable elements correlated to that axis. The motion measured by the sensor is then translated into an analog or digital signal.
- ZigBee® wireless control
ZigBee is the leading wireless control and sensory network solution, and stands apart from other RF solutions as the only standards-based technology that:
- Addresses the unique needs of sensory network applications, remote monitoring and control,
- Enables broad-based deployment of wireless mesh networks with low-cost, low-power solutions,
- Provides the ability to run for years on inexpensive primary batteries for a typical monitoring application. |
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 The purpose of this evaluation board is to adapt all existing and currently planned STEVAL-IFD001V1 (STR9 dongle) extensions to the Hitex STM32-PerformanceStick based on the STM32F103R.
The kit consists of:
- STM32-PerformanceStick interconnection board
- CD with related user manual, application notes and datasheets
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| Technical Documentation |
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| Resources |
| Gerber Files |
Download (20-February-2008, 45 KB) |
| Schematics |
Download (21-March-2008, 26 KB) |
| Bill of material |
Download (20-February-2008, 9 KB) |
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| Purchase |
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