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STMicroelectronics devices are requalified to ensure their resistance
to new soldering temperatures requested by PC board mounting with Tin-Silver-Copper
alloys : melting temperature of 217°C instead of 183°C for SnPb eutectic
alloy.
STMicroelectronics, together with Philips Semiconductors and Infineon
Technologies (E3) have published and used a hotter profile with Peak
Body Temperature at 260°C for small body packages, in anticipation of
new JEDEC standard J-STD020C
and to follow the demand from several customers .
ECOPACK™ components ensure no reliability risk due to whiskers growth
see Application notes AN2035.
ST Corporate Policy is to qualify each package family through test vehicles
representative of the most critical parameters .
A typical qualification procedure includes:
Manufacturing processes assessment in assembly plants, Specific process
validation, e.g. Tin plating process whiskers growth assessment, Qualification
lots assembly for test vehicles defined by product divisions with assembly
in–process quality controls, Package validation tests, including soldering
ability with both SnPb and Pb-free SnAgCu solders, dimensional, visual
and mechanical controls, Reliability tests.
Qualification reports are available upon request from your sales representative
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