Section

ECOPACK COMPONENTS

Ecopack is the name given to Lead-free devices and Lead-free packages from STMicroelectronics.

Lead-free devices are described inside an internal specification defining :
- their caracteristics : lead-free connections coating , solderability and identification features
- their reliability such as soldering resistance, reliability performances , whiskers risk prevention

This specification is available for ST customers upon request. Ecopack components are following the RoHS directive including its exemptions ( High temperature solder for inner packages soldering, FritSealing glass) It means that Lead-free power packages are containing Lead Solder for attachment of IC to dissipators. see certificate of compliance to RoHS directive.

STMicroelectronics is continuously working to develop and assess new Lead-free technologies to allow full Lead-free assembly devices with at least the same level of reliability than today packages





Lead-Free Semiconductor Packages